High temperature polymerization monitoring of an epoxy resin using ultrasound - Normandie Université Access content directly
Journal Articles IOP Conference Series: Materials Science and Engineering Year : 2018

High temperature polymerization monitoring of an epoxy resin using ultrasound

Nacef Ghodhbani
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Hugues Duflo
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Abstract

In this study, the real time ultrasonic monitoring is investigated to quantify changes in physical and mechanical properties during the manufacture of composite structures. In this context, an experimental transmission was developed with the aim of characterizing a high temperature polymerization reaction and post-curing properties using an ultrasonic method. First, the monitoring of ultrasonic parameters of a thermosetting resin is carried out in a device reproducing the experimental conditions for manufacturing a composite material with a process known as RTM, that is to say an isothermal polymerization at T = 160° C. During this curing, the resin is changing from its initial viscous liquid state to its final viscous solid state. Between those states, a glassy transition stage is observed, during which the physical properties are strongly changing, i.e. an increase of the ultrasonic velocity up to its steady value and a transient increase of the ultrasonic attenuation. Second, the ultrasonic inspection of the thermosetting resin is performed during a heating and cooling process to study the temperature sensitivity after curing. This type of characterization leads to identifying the ultrasonic properties dependence before, during and after the glassy transition temperature Tg. Eventually, this study is composed of two complementary parts: the first is useful for the curing optimization, while the second one is fruitful for the post-processing characterization in a temperature range including the glassy transition temperature Tg.
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hal-03128039 , version 1 (01-02-2021)

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Pierre Maréchal, Nacef Ghodhbani, Hugues Duflo. High temperature polymerization monitoring of an epoxy resin using ultrasound. IOP Conference Series: Materials Science and Engineering, 2018, 369, pp.012010. ⟨10.1088/1757-899X/369/1/012010⟩. ⟨hal-03128039⟩
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