Tuned thermoelectric properties of TiS1.5Se 0.5 through copper intercalation - Normandie Université Access content directly
Journal Articles Journal of Alloys and Compounds Year : 2015

Tuned thermoelectric properties of TiS1.5Se 0.5 through copper intercalation

Abstract

Polycrystalline samples of copper intercalated Cux TiS1.5Se 0.5 (x = 0, 0.025, 0.05 and 0.1) are synthesized by classical high temperature reaction. The resulting powders are successfully densified by using spark plasma sintering. As expected, XRD refinements show that Cu intercalation between TiS1.5Se 0.5 slabs induces an increase in the c lattice parameter. Electrical resistivity and Seebeck coefficient decrease drastically with increasing Cu content, direct consequence of the increased carrier concentration. In parallel, the lattice thermal conductivity of CuxTiS1.5Se 0.5 is significantly reduced compared to unfilled TiS1.5Se 0.5. Overall, the dimensionless thermoelectric figure of merit increases with temperature and reaches a maximum value of 0.54 at 700 K for Cu0.05TiS1.5Se 0.5, the highest value so far observed in layered titanium chalcogenides. © 2015 Elsevier B.V. All rights reserved.
No file

Dates and versions

hal-02184189 , version 1 (15-07-2019)

Identifiers

Cite

R. Nunna, F. Gascoin, E. Guilmeau. Tuned thermoelectric properties of TiS1.5Se 0.5 through copper intercalation. Journal of Alloys and Compounds, 2015, 634, pp.32-36. ⟨10.1016/j.jallcom.2015.02.021⟩. ⟨hal-02184189⟩
15 View
0 Download

Altmetric

Share

Gmail Facebook X LinkedIn More