Bonding Characterization of a Three-Layer Metal-Adhesive-Metal Using Shear Horizontal Modes of Close Dispersion Curves
Abstract
This work presents numerical and experimental results on the evaluation of the quality of bonding in a metaladhesive-
metal three-layer structure using shear horizontal (SH) guided waves. The studied samples have different
levels of adhesion. A numerical finite element simulation based on the Jones model permits to predict the
dispersion curves in the different cases. An experimental study, based on a generation of waves by an EMAT
transducer and a reception by a piezocomposite transducer, is performed. Results show that a criterion on the
quality of the bonding can be found when the quality of the adhesive is degraded by addition of grease in the
adhesive, based on the simultaneous propagation, or not, of two close wavenumber-frequency modes of the threelayer.